Wafer Bonding Agreement
Mar 18, 2010 — 3M of St. Paul, Minn., an advanced materials supplier for the semiconductor industry, and Tazmo Co. Ltd. of Okayama, Japan, an LCD manufacturing equipment and semiconductor supplier, have announced an agreement allowing the latter company to manufacture and sell equipment for temporary bonding of ultrathin wafers required for 3-D packaging. Under terms of the agreement, Tazmo will become a supplier for equipment configured to use 3M’s wafer support system materials, including the Liquid...