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Dow Corning Joins imec To Advance IC Semiconductor Packaging

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SENEFFE, Belgium, July 10, 2013 — Dow Corning announced that it has joined nanoelectronics research center imec to advance 3-D integrated circuit (IC) packaging technologies that stack IC chips in vertical 3-D architectures. The announcement was made Monday at Semicon West in San Francisco. By integrating multiple chips into a single package, 3-D IC technology promises to reduce form factor and power consumption, and increase bandwidth to enable more efficient inter-chip communication for next-generation microelectronic devices. Before 3-D IC fabrication can be broadly adopted, it will require advances in materials and...Read full article

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    Published: July 2013
    AmericasBelgiumBusinessCaliforniaCMOSDow CorningEric BeyneEuropeIMECindustrialintegrated circuit semiconductor packagingOpticsSEMICON WestTSV semiconductor packagingWafers

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