Dow Corning Establishes Thin Film Technology Platform
Jan 30, 2002 — MIDLAND, Mich., Jan. 30 -- Dow Corning Corp. recently launched a new program, the Thin Film Technology Platform, to identify, develop and promote new products based on thin-film materials and processes. The platform was established to support and serve the company's high-growth electronics and new ventures business units, which include efforts in energy, photonics, plasma, flat panel displays, semiconductor device fabrication and packaging. The program aims to identify high-value applications...