WAFER CUTTING
Resonetics LLCRequest Info
Resonetics Inc. announces a noncontact silicon wafer cutting technique,
using a new laser process to cut patterns such as arcs, curves, circles
and rectangles. Key features include narrow kerf widths and cutting
speeds comparable to traditional straight-line dicing techniques.
Typical applications include dicing optoelectronic circuits such as
wavelength division multiplexers, microelectronics packaging,
solid-state high-voltage components and other components requiring
precise nonlinear work.
https://www.resonetics.com
/Buyers_Guide/Resonetics_LLC/c12724
Published: December 1997
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