Rudolph to Fulfill $11M Wafer-Level Packaging System Order

WILMINGTON, Mass., July 4, 2016 — Defect inspection, lithography, metrology, and process control software developer Rudolph Technologies Inc. said it has received a multisystem order for its fan-out wafer level packaging (FOWLP) system from an outsourced assembly and test firm in Asia. The order is valued at $11 million.

The order consists of multiple process control inspection systems and a yield-management software suite, and will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in the second quarter of 2016, with the majority of the order shipping in the second half of 2016.

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Published: July 2016

Glossary

process control: The collection and analysis of data relevant to monitoring the rate and quality of industrial production, either continuously or in batches. Corrections can be made manually or automatically, via a feedback control loop.
metrology: Metrology is the science and practice of measurement. It encompasses the theoretical and practical aspects of measurement, including the development of measurement standards, techniques, and instruments, as well as the application of measurement principles in various fields. The primary objectives of metrology are to ensure accuracy, reliability, and consistency in measurements and to establish traceability to recognized standards. Metrology plays a crucial role in science, industry,...