Search
Menu
Meadowlark Optics - Wave Plates 6/24 LB 2024

Manufacturing Microelectronics Using ‘Lase-and-Place’

Facebook X LinkedIn Email
Lasers enable further miniaturization in electronics by placing tiny components directly into circuit boards.

Scott A. Mathews, Nicholas A. Charipar, Kristin Metkus and Alberto Piqué, US Naval Research Laboratory

Microelectronic circuits traditionally are fabricated by placing packaged components, such as integrated circuits and surface-mount devices, on the surface of a circuit board and connecting the components together. As the demand for miniaturization has grown, however, the size of these packaged components has become a limiting factor. There are various ways to address this limitation; for instance, application-specific integrated circuits, which eliminate the need for individual components. Instead, the entire circuit is fabricated in one fell swoop and then packaged. However, development...Read full article

Related content from Photonics Media



    Articles


    Products


    Photonics Handbook Articles


    White Papers


    Webinars


    Photonics Dictionary Terms


    Media


    Photonics Buyers' Guide Categories


    Companies
    Published: October 2007
    energyFeaturesindustrialintegrated circuitsmicroelectronic circuitsSensors & Detectorssufrace-mount devices

    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.