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Enosemi and Jabil Partner on Packaging for Photonic Chips

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LOS GATOS, Calif., March 4, 2025 — Silicon photonics startup Enosemi has entered into a collaboration with Jabil, which will provide Enosemi with packaging services to support higher bandwidth interconnects within AI compute systems. The partnership leverages Jabil’s expertise in silicon photonics, in particular its Advanced Photonics Packaging NPI center in Ottawa, Ontario. Per the collaboration, Enosemi's chiplet and intellectual property (IP) customers will be able to leverage Jabil's expertise to develop highly integrated packages with AI application-specific integrated circuits and photonic chips. ...Read full article

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    Published: March 2025
    Businessphotonic integrated circuitsPICschipschipletpackagingadvanced packagingsilicon photonicsEnosemijabilmanufacturingpartnershipcollaborationAmericas

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