Emberion Funding Round Fuels Production, Expansion
ESPOO, Finland, July 2, 2025 — Emberion Oy, a developer of advanced infrared and hyperspectral imaging solutions, has completed a funding round co-led by Nidoco AB and Verso Capital. The undisclosed sum will help the company to scale production to meet rising demand in industrial, environmental, and defense markets, according to the company. Additionally, Emberion will make investments to implement wafer level packaging, a manufacturing method patented by Emberion that enables low-cost packaging for its sensors.
Emberion named Sami Kyllönen CEO last year. The company reported a funding round in 2022 worth ~$7 million.
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