Circuit/Chip Packaging Platform
SUNNYVALE, Calif., June 20, 2022 — The VIPack™ packaging platform from Advanced Semiconductor Engineering Inc. is designed to enable vertically integrated package solutions.
The platform leverages advanced redistribution layer processes, embedded integration, and 2.5D and 3D technologies when integrating multiple chips within a single package. The six core packaging technology pillars include high-density, RDL-based Fanout Package-on Package (FOPoP); Fanout Chip-on-Substrate, (FOCoS); Fanout Chip-on-Substrate-Bridge...
Advanced Semiconductor Engineering Inc. (ASE)