FAST-CURING ADHESIVE
Master Bond Inc.Request Info
Master Bond Inc. has developed a two-part, silver-filled, electrically
conductive adhesive that cures rapidly at room temperature. The Model
EP77M-F compound has a one-to-one mix ratio and can set up in ambient
temperatures within 5 to 7 min, even when mixed in very small amounts.
It features a high bond strength of 1500 psi tensile shear when fully cured
at room temperature. The adhesive does not contain any diluents or solvents,
and bonds are resistant to oil, water and most organic solvents.
https://www.masterbond.com
/Buyers_Guide/Master_Bond_Inc/c9086
Published: March 1997
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Master Bond Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required