Electro-Optical Wafer Tester
ficonTEC Service GmbHRequest Info
ACHIM, Germany, March 27, 2025 — 
ficonTEC’s 300-mm double-sided electro-optical wafer tester enables high-throughput testing of silicon photonic integrated circuit (PIC) devices at wafer level. Utilizing automatic test equipment architectures, the system’s optical test cell docks with it at a software and hardware level enabling DC and high-data-rate test capability on the top side and precision optical six-axis active alignment probing below. The wafer tester also accommodates automatic wafer loading, incorporating a vacuum thermal control chuck assembly, in-situ fiber array calibration, end-face inspection, high-speed probe calibration, and automated PIC mapping.
https://www.ficontec.com
/Buyers_Guide/ficonTEC_Service_GmbH/c4926
Published: March 2025
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to ficonTEC Service GmbH by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required