An agreement to expand access to the 3M Wafer Support System equipment has been signed by 3M of St. Paul, Minn., and Suss MicroTec of Garching, Germany. The German company will become an authorized equipment supplier for the 3M system, which temporarily bonds the ultrathin wafers required for 3-D packaging. Suss MicroTec also will manufacture and sell wafer bonders designed to use 3M’s materials.