THOUSAND OAKS, Calif., May 5 -- Rockwell Scientific Co. has received a $15.5 million contract from the US Army Communications-Electronics Command and Night Vision and Electronic Sensor Directorate to improve production technology for third-generation infrared sensors, as part of the Army's dual-band focal plane array manufacturing program. Rockwell Scientific will develop improved manufacturing processes for large-format, small pixel, dual-band (two-color) infrared focal plane arrays (FPAs) at its new Camarillo production facility, with the goal of reducing the cost per unit tenfold. Rockwell...Read full articleRelated content from Photonics MediaArticlesMultispectral Terahertz Imaging System Incorporates Neural NetworkResearchers at UCLA have developed a focal plane array (FPA) capable of supporting real-time multispectral terahertz (THz) video in 3D. 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