Optoelectronic solutions developer Plessey Semiconductors Ltd. has entered into a collaboration with the EV Group, a supplier of wafer bonding and lithography equipment, to bring high-performance gallium nitride-on-silicon (GaN-on-Si) monolithic microLED technology to the mass market. Plessey has purchased a GEMINI production wafer bonding system from EVG to enable bonding and alignment at Plessey’s fabrication facility in Plymouth, England. This enables Plessey to bond its GaN-on-Si microLED arrays to the panel’s backplane at a wafer level, and with the high level of alignment precision necessary to enable very small pixel dimensions. EVG’s patented SmartView NT Automated Bond Alignment System technology is suitable for Plessey’s requirements because it allows face-to-face alignment of the wafers with high precision. A maximum level of automation and process integration is achieved by the GEMINI Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 300 mm for volume manufacturing are all performed in one fully automated platform.