Layer Release System
EV Group (EVG)Request Info
The EVG®850 NanoCleave™ from EV Group is a system that enables nanometer-precision release of bonded, deposited, or grown layers from silicon carrier substrates. The system does this by utilizing an IR laser coupled with specially formulated inorganic release materials in a high-volume-manufacturing capable platform, eliminating the need for glass carriers. This in turn enables ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory, and power device formation.
https://www.evgroup.com
/Buyers_Guide/EV_Group_EVG/c4622
Published: January 2024
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