A new high temperature resistant, room temperature curing epoxy adhesive, sealant and encapsulant is now available from Master Bond Inc. This two-component system called EP21HT has a noncritical one to one mix ratio, weight or volume. It has a service operating temperature range of -60 to 400 °F. EP21HT produces durable, high strength, exceptionally tough bonds to both similar and dissimilar substrates. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is excellent. Bonds are also resistant to thermal cycling and many chemicals including water, oil, fuels and...Read full articleRelated content from Photonics MediaArticlesHybrid Photoresist Helps Meet Demand for Smaller ChipsTo achieve performance gains in microelectronics, semiconductor size continues to shrink, with feature sizes now in the sub-10-nm range. 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