In a collaboration aimed at providing cost-effective semiconductor materials for 22-nm nodes, JSR Corp.’s US operation, JSR Micro, has joined Sematech, a global consortium of chipmakers, at the College of Nanoscale Science and Engineering (CNSE) of the University of Albany. JSR will collaborate with Sematech’s Resist Materials and Development Center (RMDC) engineers on key resist issues in extreme ultraviolet (EUV) lithography. Focus areas will include: • Working to reduce or eliminate line edge roughness in lithographic images below 22 nm. • Discovering ultimate resolution of newly formulated photoresists. • Testing various imaging materials for EUV sensitivity. Sematech and JSR have partnered in several technology development programs, including 300-mm test wafers, low-k films and advanced resists (double-exposure materials). “We have a successful history of partnership with Sematech, and we are excited to continue that history in the field of EUV,” said Hozumi Sato, managing director of JSR, who is responsible for the research and development. “Combining resources to create next generation of EUV materials is not only good for JSR and Sematech but will benefit the industry as a whole." “We’re looking forward to working with JSR in our mutual effort to develop leading-edge resists and materials and accelerate process availability for EUV pilot line manufacturing,” said John Warlaumont, vice president of Advanced Technology at Sematech. “Our successful experience in our previous partnerships will contribute greatly to RMDC’s effectiveness.” “The addition of JSR to the roster of global companies at CNSE’s Albany NanoTech Complex will further enhance the Sematech-CNSE partnership in driving leading-edge nanoelectronics innovations,” said Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. “This collaboration is enabling advances in a host of technologies, including EUV lithography, which are critical to industry.” For more information, visit: www.cnse.albany.edu