Indium Corp., a materials supplier for the global electronics, semiconductor, solar, thin-film and thermal management markets, has signed a joint marketing and technical support agreement for high-temperature lead-free (Pb-free) electronics assembly materials patented and manufactured by Ormet Circuits Inc. of San Diego. Under the terms of the agreement, the former company will offer a line of high-temperature, lead-free assembly materials that address the requirements of power semiconductor and semiconductor packaging applications. The latter company, a conductive materials manufacturer, will leverage the former company’s global sales and technical support capabilities to offer the products into the electronics assembly, passive component assembly and semiconductor assembly markets. Indium will leverage the California-based company’s materials set. For more information, visit: www.indium.com
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