IRVINE, Calif., Aug. 28 -- Newport Corporation announced that it has been issued its second US patent in a series of patent applications that extend the company's leadership in next-generation technology in the fabrication of semiconductor equipment products.
Newport's US Patent, covering improvements in 300 mm edge-grip robotic end effectors, includes technology that allows semiconductor equipment manufacturers to efficiently and reliably handle 300 mm wafers during fabrication and testing. The patent strengthens and deepens Newport's protection of its properties in this field and represents one of several relating to the technology of providing edge grip mechanisms for use in the semiconductor equipment industry.
The new system utilizes improved failsafe design features, which further minimize the potential for wafer mishandling, virtually eliminating wafer damage and particulate generation in the process of gripping and transferring the wafer from the cassette to the fabrication or metrology areas of the tools.