FORT LAUDERDALE, Fla., Sept. 21 -- Lambda Technologies will be exhibiting their patented variable frequency microwave (VFM) curing technology and their products at IMAPS 2001. VFM is a breakthrough that allows significantly faster curing of standard, off-the-shelf, polymeric adhesives used to encapsulate electronic components or attach them to circuit boards, while eliminating the hot spots and arcing associated with conventional microwave technology. Advanced packaging and assembly applications include post-mold cure, cavity dam and fill, glob-top, BGA and flip chip underfill for die-attach, wafer processing, chip-on-board/flexible circuits, coatings and optical component and fiber optic assemblies.

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