EV Group (EVG), a supplier of wafer-bonding and lithography equipment for semiconductor and packaging, microelectromechanical systems (MEMS), silicon-on-insulator and nanotechnology markets, announced it has received an order from the Indian Institute of Technology (IIT), in Bombay, India, for two MEMS-focused systems: an EVG620TB bond and mask aligner and an EVG501 wafer bonder. They will be used in a new Indian government-supported automotive MEMS R&D project that ITT is conducting with the Indian Institute of Science, Bangalore, which previously bought identical EV equipment. The new EVG systems are slated for installation this month at IIT Bombay's Mumbai facility. EVG is based in St. Florian, Austria, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. The Centre of Excellence in Nanoelectronics at IIT Bombay conducts research in nanoscale devices and microfabricated sensors.