A consortium funded by the European Union (EU) is developing advanced high-resolution image sensing technology that could be used in a variety of space missions, including Earth observation, planetary exploration, and scientific research. The three-year Technology for European iNdependence in Space Image Sensor (TENSIS) project will address the EU-based development of advanced CMOS imaging sensors. The project will aim to create a strategic, competitive advantage for European prime and equipment manufacturers and reduce the dependence on critical technologies and capabilities from outside the EU. The three-year TENSIS project was launched on Feb. 11 at an inauguration event in consortium member Teledyne e2v's facilities in Saint-Egrève, France. Courtesy of Teledyne. The aim of the program is to validate a scalable, large-area, high-resolution, radiation tolerant, customizable, and affordable 180-nm CMOS detector, with the key technical characteristics of a 24K × 16K stitched CMOS matrix of 400MP. A smaller 4K × 4K stitched CMOS array will also be designed and manufactured. The project comprises several industrial partners. Teledyne e2v Semiconductors SAS and Teledyne Innovaciones Microelectronicas SL will oversee the project and design the detectors, including the pixel, while imec will manage the development of the optical stack on top of the CMOS detector including filters and optical microlenses. Meanwhile, Airbus Defence and Space SAS will lead the development of the test equipment and assess the performance of the detector prototypes. Alter Technology Tüv Nord will validate the smaller 4K × 4K detector for use in the space environment. The project will run until Dec. 31, 2027. The 24k × 16k stitched CMOS array is expected to reach technology readiness level (TRL) 6, with a prototype sensor tested in a relevant environment. The 4k × 4k CMOS detector is targeted for TRL7.