NEUCHATEL, SWITZERLAND, February 26, 2004 - Bookham Technology plc and Colibrys SA report that they have jointly employed MEMS technology to create and implement variable optical attenuator modules.
Bookham Technology has designed and patented three-dimensional MEMS structures with micro-shutters to produce optical attenuation with analog control. To successfully commercialize these component parts, Bookham has designed them as generic building blocks that are readily integrated into modules such as dynamic transmitters and receivers.
Colibrys has established innovative approaches to the fabrication of a MEMS die that embodies the Bookham designs. In this successful collaboration, a dedicated snap-apart method is deployed for MEMS-wafer dicing as a necessary replacement for standard semiconductor dicing strategies that prove to be unsuitable for these categories of MEMS devices. This approach delivers high-yield separation (singulation) of MEMS chips in a manner compatible with standard pick-and-place semiconductor equipment and ensures maximum reliability by avoiding particulate generation.
For more information contact www.bookham.com or www.colibrys.com