Search
Menu
Spectrogon US - Optical Filters 2024 LB

Curing of an Optical Adhesive by UV Irradiation by DSC

Facebook X LinkedIn Email
Wednesday, April 7, 2021
PerkinElmer (See Revvity)

Optical adhesives are used in many industries such as semiconductors and chip manufacturing where solvents are undesirable. Power compensated instruments are the best choice for fast analysis of the curing profile and measurement of the energy of curing reactions as the design allows quick detection and response to changes in the optical material. This application note describes how Photo-DSC using power compensation technique is a powerful tool for studying and quantitatively characterizing optically curing materials.

Download Application Note
File: Curing_of_an_Optical_Adhesive_by_UV_Irradiation.pdf (1.60 MB)
To download this application note, please complete the *required fields before clicking the "Download" button.
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:




When you click "Download", you agree that your personal contact information may be shared with PerkinElmer (See Revvity) and they may contact you about their products and services in the future. You also agree that Photonics Media may contact you with information related to this request, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required
Electronics & Signal Analysisspectroscopy equipmentoptical components & softwarechemistrychemical engineeringsemiconductorsspectroscopyoptical adhesivesDSC
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.