About This Webinar
This webinar will encourage activity in the growing field of flexible glass, including the design and performance of electronic and optoelectronic devices for thin, lightweight, and flexible or curved applications. Presenter Sean Garner will discuss the properties of flexible glass — including flexible Corning Willow Glass — and provide examples of emerging applications, device designs, and fabrication processes.
The unique attributes of flexible glass, at thicknesses ≤200 µm, make it suitable for applications that are not possible or practical with other substrate materials. Compared to alternatives, glass substrates offer advantages of dimensional and thermal stability, hermeticity, optical performance, and surface quality. Additionally, a disruptive ecosystem, including high-throughput roll-to-roll manufacturing, is emerging to specifically process and integrate flexible glass devices at a manufacturing scale.
About the presenter:
Sean Garner is a senior research associate at the Corning Research & Development Corp. where he has worked for more than 20 years. He received a B.Eng. in engineering physics (applied laser and optics) from Stevens Institute of Technology and a Ph.D. in electrical engineering (electrophysics) from the University of Southern California.
At Corning, Garner works in the area of materials processing and device prototyping. He has co-authored over 200 journal articles and conference presentations and has been granted more than 40 U.S. patents. He continues to be actively involved in the research and development of flexible Corning Willow Glass and receives frequent international invitations for invited talks and guest lectures.
Who should attend:
Scientists, engineers, educators, and students working in the field of flexible electronics and optoelectronics who are interested in exploring new applications, device designs, materials, and manufacturing methods.
Read more about flexible glass substrates in this article by Sean Garner:
Flexible Glass Substrates Enable Large-Scale Integration (
Photonics Spectra, Nov. 2018).