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Teledyne DALSA - Linea HS2 11/24 LB

Wafer-Level Camera Module

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SANTA CLARA, Calif., Aug. 16, 2016 — Wafer-Level Camera ModuleOmniVision Technologies Inc. has announced the OVM6946 wafer-level camera module for medical applications.

With a compact size of 1.05 × 1.05 mm, the 1/18-in. OVM6946 is well-suited for minimally invasive endoscopes. A wafer-level module technology can help OEMs simplify and shorten their development cycles. It can also help streamline their manufacturing processes because of minimal tuning needs and suitability for automated assembly.

The reduced pinout and analog output for transmission over long distances with minimal signal-to-noise reduction enables seamless integration into single-use endoscopes. The OVM6946 can be customized for a wide range of endoscope applications, including medical, veterinarian and industrial.



Published: August 2016
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