Ultrasonic and Laser Bonding
F&K Delvotec Inc.Request Info
• 15-mm-deep access option on ball bonding
provides highest clearance in the market.
• RGB light provides good contrast that
improves image quality.
• Bond-process feature monitors and controls
the ultrasonic, deformation, and bond time
throughout the bonding process to ensure
bond quality consistency.
• Our ball-, wedge-, and laser-bond technologies
cover applications required by automotive,
aerospace,
https://www.fkdelvotec.com/en
/Buyers_Guide/FK_Delvotec_Inc/c4688
Published: April 2021
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to F&K Delvotec Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required