ULTRATHIN SUBSTRATES
Valley Design Corporation, HeadquartersRequest Info
Valley Design Corp. has developed ultrathin silicon and GaAs wafers with
precision-lapped, polished or chemically etched circuitries. Wafers as thin
as 10 µm may be obtained. The company specializes in tight thickness
specifications and fine polishing.
http://www.valleydesign.com
/Buyers_Guide/Valley_Design_Corporation_Headquarters/c15595
Published: March 1997
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