Thickness Measurement System
Hamamatsu CorporationRequest Info
The HyperGauge thickness measurement system C17319-11 from Hamamatsu is designed for full-surface measurement of 300-mm wafers using a high-sensitivity camera within semiconductor manufacturing processes. The device uses high resolution and measurement reproducibility for both bare and patterned wafer inspection. The system can reduce process losses and improve yield in semiconductor manufacturing.
https://www.hamamatsu.com
/Buyers-Guide/Hamamatsu-Corporation/c5841
Published: December 2025
From the Photonics Marketplace
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