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Teledyne DALSA - Linea HS2 11/24 LB

Solder Mask Technology

Limata GmbHRequest Info
 
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Solder Mask TechnologyLUVIR Solder Mask Technology from Limata GmbH is available on X-series model types to increase the speed of solder mask direct imaging at a lower total cost of ownership.

The technique utilizes both UV and IR lasers, shortening imaging cycle times and increasing throughput. Higher imaging efficiency and throughput levels are achieved on all conventional solder mask ink types and colors, as well as on legend inks, further eliminating the need for printed circuit board (PCB) manufacturers to transition from conventional standard ink material to more expensive inks.

In addition, LUVIR fully supports the digital imaging of PCB structures at coating thicknesses in the 100- to 150-µm range without significant undercut.



Published: September 2020
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ProductsSolder Mask TechnologyLimataLUVIRLasersImagingEurope

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