Lidar Receiver Subsystem
Advanced Thermal Solutions Inc.Request Info
NORWOOD, Mass., Nov. 4, 2021 — 
fanSINKS™ heat sinks from Advanced Thermal Solutions Inc. are designed for component sizes ranging from 27 to 70 mm2.
The wider size range accommodates hot semiconductor components, including field-programmable gate arrays, application-specific integrated circuits, and other package types used in telecommunications, optics, test and measurement, military and other applications. The fanSINKS feature cross-cut, straight aluminum fins. They support omnidirectional airflow for optimum cooling performance from attached fans and ambient air.
The devices attach securely to components using the maxiGRIP™ high-reliability mechanical attachment system. For larger components, they mount tightly to printed circuit boards using PEM pushpins that secure into 3-mm through holes.
https://www.qats.com
/Buyers_Guide/Advanced_Thermal_Solutions_Inc/c332
Published: November 2021
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