Laser Line Shaper

Holo/Or Ltd.Request Info

NESS-ZIONA, Israel, Oct. 30, 2020 — Laser Line Shaper

The Top-Hat Line Shaper from Holo/Or features high throughput for wafer and panel processing of large areas in laser annealing and lift-off applications.

By integrating the large-angle devices in a single-mode laser system, users achieve high peak intensity over a large area by shaping the beam to a narrow, diffraction limited line. Properties include a line angle of >150 mRad, diffraction-limited line width, sharp diffraction limited energy drops at edges, a flat top intensity profile that is uniform over the entire line, and more. Its wavelength ranges from deep UV to NIR. Pure fused silica provides a high laser damage threshold coating for demanding applications.

Applications include lasers, microelectronics, semiconductors, photovoltaics, displays, and more.

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Published: October 2020

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