Laser Assembly Gain Chip
HieFoRequest Info
ALHAMBRA, Calif., Sept. 16, 2024 — 
The HGC20 from HieFo is a high efficiency C+ band gain chip for building integrated tunable lasers. The chip is 1 mm in cavity length mounted on a proprietary submount and is capable of producing optical outpower approaching 22 dBm. For applications requiring lower overall module power consumption, the HGC20 improves wall plug efficiency by as much as 40%.
http://www.hiefo.com
/Buyers_Guide/HieFo/c34069
Published: September 2024
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