Laser Annealing System
3D-Micromac AGRequest Info
CHEMNITZ, Germany, July 19, 2018 — 
The microPRO RTP laser annealing system from 3D-Micromac AG is designed to enable several key process steps in semiconductor, power device, and MEMS manufacturing.
Combining a state-of-the-art laser optic module with 3D-Micromac's modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system. The microPRO RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing. The system offers three optional laser wavelengths.
Applications include dopant activation for insulated-gate bipolar transistors (IGBTs) and activation of backside-illuminated CMOS image sensors and amorphous silicon; ohmic contact formation in silicon carbide power devices to improve resistance; and giant magneto-resistive and tunneling magneto-resistive sensor manufacturing, among others.
https://3d-micromac.com
/Buyers_Guide/3D-Micromac_AG/c17461
Published: July 2018
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