HD Thick-Film Etchable Gold Process
Remtec Inc.Request Info
NORWOOD, Mass., April 19, 2018 — 
A high-definition etchable thick-film (HDTF) gold process on ceramic has been announced by Remtec Inc., offering advancement in miniaturization, circuit density, and performance.
Remtec’s etchable gold substrates allow the use of ultrafine lines with a standard line/spacing resolution of 50/50 µm and premium circuit of 25/25 µm. Circuit designers can also benefit from Remtec’s capability for added value features available on the same substrate. In addition to an etchable gold circuit, Remtec’s HDTF can incorporate conductor multilayers. It also integrates built-in components such as Lang couplers, inductors, filters, and high-precision resistors in a wide range from 50 mΩ to 1 MΩ laser trimmed to ±1 percent on the same ceramic base.
Typical applications for etchable gold HDTF ceramic metallization include use in products requiring high-circuit density and conductor proximity. HDTF substrates used for high-performance products such as mm-wave microwave circuits and high-pin-count analog and digital designs are ideal for radar, missile, and satellite communications systems in both defense and industrial applications.
http://www.remtec.com
/Buyers_Guide/Remtec_Inc/c12684
Published: April 2018
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Remtec Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required