Flip-chip Bonder
SET Corp. SARequest Info
SAINT-JEOIRE, France, Dec. 2, 2022 — 
The FC150 PLATINUM advanced R&D flip-chip bonder from Smart Equipment Technology Corp. SA is designed for the telecom, quantum, automotive, defense, high-performance computing, artificial intelligence, and virtual reality markets.
An alignment accuracy of ±0.1 µm is featured, with parallelism between the two samples adjusted within a few microradians. The FC150 PLATINUM offers both manual and automatic modes. It is designed for up to 100-mm chip-to-chip and 200-mm chip-to-wafer applications on the same open platform. It covers a range of applications from low to high forces between 0.25 and 2000 N.
http://www.set-sas.fr
/Buyers_Guide/SET_Corp_SA/c17227
Published: December 2022
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