Flip-Chip Bonder
Shibuya Corp.Request Info
The FDB210P Flip Chip Bonder from Shibuya Corp. can be used for the mass production of optical devices and semiconductors that require sub-μm level of bonding accuracy.
The system is able to handle microchips of up to 0.15 sq. mm, achieving high-accuracy alignment within sub-μm post bonding. Its highly rigid frame is hardly affected by temperature fluctuation, and full-closed axes control enables accurate alignment. These features maintain high-accuracy bonding performance stability.
The bonding process for multiple chips can be easily achieved by high-speed pulse heaters equipped on the bond head and bond stage. A unique post-bonding N2 purge mechanism and monitoring function stabilize bondability.
https://www.shibuya.co.jp/en
/Buyers_Guide/Shibuya_Corp/c32558
Published: October 2020
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