Fan-Out-Package-on-Package
Advanced Semiconductor Engineering Inc. (ASE)Request Info
The Fan-Out-Package-on-Package (FOPoP) solution from Advanced Semiconductor Engineering Inc. is designed to lower latency and deliver bandwidth advantages for the dynamic mobile and networking markets.
Positioned under the VIPack™ platform, FOPoP reduces the electrical path by 3× and enables bandwidth density by up to 8×, allowing engine bandwidth expansion up to 6.4 Tbps/unit. Interconnect capabilities, proximity driven impedance enhancements, stacked vias, and vertical coupling enablement drive the vertical integration methodology used in the FOPoP structure. Applications include next-generation solutions for processors, antenna-in-package devices, and silicon photonics uses.
https://ase.aseglobal.com
/Buyers_Guide/Advanced_Semiconductor_Engineering_Inc_ASE/c33233
Published: March 2023
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