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Teledyne DALSA - Linea HS2 11/24 LB

Direct Imaging Solution

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Direct Imaging SolutionThe Orbotech Corus8M direct imaging solution from KLA Corp. supports innovation for printed circuit boards and integrated circuit substrates.

Combining the functionality and automation of a direct imaging production line in a closed, clean, and compact unit, the platform provides increased resolution with high accuracy to pattern finer lines. It supports highly efficient, double-sided imaging in a fully automated solution optimized for high throughput and capacity to achieve fine resolution down to 8-µm line widths and higher registration accuracy of ±5 µm for advanced applications.



Published: November 2022
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ProductsOrbotech Corus 8Mdirect imaging solutionKLAImagingAmericas

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