Die Bonder
MRSI MycronicRequest Info
TEWKSBURY, Mass., Aug. 3, 2022 — The MRSI-H-HPLD+ die bonder from MRSI Systems is tailored for high-power laser die attachment applications.
Improving throughput by using parallel processing, the die bonder is a variant of the MRSI-H-HPLD model. It can be used in high-mix, high-volume flexible manufacturing, maintaining high accuracy and flexibility.
https://www.mrsisystems.com
/Buyers_Guide/MRSI_Mycronic/c31792
Published: August 2022
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