Die Bonder
MRSI MycronicRequest Info
The MRSI-H-HPLD+ die bonder from MRSI Systems is tailored for high-power laser die attachment applications.
Improving throughput by using parallel processing, the die bonder is a variant of the MRSI-H-HPLD model. It can be used in high-mix, high-volume flexible manufacturing, maintaining high accuracy and flexibility.
https://www.mrsisystems.com
/Buyers_Guide/MRSI_Mycronic/c31792
Published: August 2022
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to MRSI Mycronic by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required