Circuit/Chip Packaging Platform
Advanced Semiconductor Engineering Inc. (ASE)Request Info
SUNNYVALE, Calif., June 20, 2022 — 
The VIPack™ packaging platform from Advanced Semiconductor Engineering Inc. is designed to enable vertically integrated package solutions.
The platform leverages advanced redistribution layer processes, embedded integration, and 2.5D and 3D technologies when integrating multiple chips within a single package. The six core packaging technology pillars include high-density, RDL-based Fanout Package-on Package (FOPoP); Fanout Chip-on-Substrate, (FOCoS); Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge); Fanout System-in-Package (FOSiP); and Through Silicon Via (TSV)-based 2.5D, 3D integrated circuit and co-packaged optics processing capabilities.
https://ase.aseglobal.com
/Buyers_Guide/Advanced_Semiconductor_Engineering_Inc_ASE/c33233
Published: June 2022
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