C2M Interconnect
TeraSignalRequest Info
IRVINE, Calif., Sept. 27, 2024 — 
The TSLink from TeraSignal is an intelligent chip-to-module (C2M) interconnect for data transmission between large ASICs and linear optical modules. The interconnect can interface with existing ASICs for connection with various types of linear optics such as linear pluggable optics, near package optics, co-packaged optics, and active copper cables. The TSLink is designed to be agnostic to protocols (Ethernet, PCIe, InfiniBand, etc.), modulation schemes (NRZ, PAM4, etc.) and media (fiber, copper) and features a lower bit error rate and reduced power consumption.
https://terasignal.com
/Buyers_Guide/TeraSignal/c33994
Published: September 2024
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