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Teledyne DALSA - Linea HS2 11/24 LB

Automotive Wafer-Level Camera Module

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SANTA CLARA, Calif., July 15, 2020 — Automotive Wafer-Level Camera ModuleThe OVM9284 CameraCubeChip automotive wafer-level camera module from OmniVision Technology Inc. enables more accurate driver monitoring systems.

The 1-MP module has a compact size of 6.5 × 6.5 mm to provide driver monitoring system designers with maximum flexibility on placement within the cabin while remaining hidden from view. Additionally, it has low power consumption, enabling it to run continuously in the tightest of spaces and at the lowest possible temperatures for maximum image quality.

The OVM9284 is built on OmniPixel®3-GS global-shutter pixel architecture, which provides high quantum efficiency at the 940-nm wavelength for high quality driver images in near or total darkness. The integrated OmniVision image sensor has a 3-µm pixel and a ¼-in. optical format, along with 1280 × 800 resolution.



Published: July 2020
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ProductsAutomotive Wafer-Level Camera ModuleOVM9284cameracubechipOmniVision TechnologyImagingcamerasautomotiveAmericas

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