Active Alignment and Micro Assembly
nanosystec GmbHRequest Info
Our assembly solutions enable
active alignment with <1 μm
precision for optoelectronic
applications. Depending on the
process requirements, epoxy
bonding, selective laser soldering,
and laser micro welding are available
as integrated joining technologies.
Our systems combine highly
dynamic and precise motion axes
with modular equipment and flexible gripper options and intelligent
image processing. Visit us at Photonics West 2026, booth #3281.
https://www.nanosystec.com/us
/Buyers-Guide/nanosystec-GmbH/c17445
Published: December 2025
From the Photonics Marketplace
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