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Photonics Media Presents: The Integrated Photonics Newsletter (9/26/2023)

Photonics Media Presents: The Integrated Photonics Newsletter

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Tuesday, September 26, 2023

Integrated Photonics Newsletter

Five Common Design Mistakes Can Send PIC Packaging Costs Skyrocketing

We have all heard that photonic integrated circuits (PICs) can pack a ton of functionality into high-performance, energy-efficient, and low-cost microchips, as well as the promise that they will enable a revolution of powerful optoelectronic devices for a host of applications. However, the complexity of transforming chips into functional devices is often underestimated and the cost of PIC packaging can take a notoriously big chunk out of the development budget. Read Article

On-Chip Lidar Sheds Cost, Size, and Power Use to Expand Adoption

Chip-based lidar is poised to revolutionize an already fast-emerging technology sector. Unlike conventional systems, chip-based lidar can be fabricated using standard semiconductor manufacturing techniques, allowing for significant cost reduction, smaller form factors, and more scalable manufacture. Read Article

More News

Photonic Chip Drives Scalable Data Transfer    Read Article

Quantum-Dot Laser Elevates Efficacy of Frequency Combs for PICs    Read Article

Dutch Foundry SMART Photonics Secures $111M in Financing    Read Article

Photonic Chip Transforms Single Light Beam into Multiple    Read Article

Active-passive GaN Scheme Shows Promise for Photonic Integration    Read Article

Featured Products & Services

Photonics Media - The 2023 Photonics Buyers’ Guide

Lithography System

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The NSR-S625E argon fluoride (ArF) immersion scanner from Nikon Corp. is optimized for middle critical layers. The lithography system provides enhanced throughput and operational stability for the efficient production of semiconductor devices.

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Photonic Alignment Platform

PI (Physik Instrumente) LP, Motion Control, Air Bearings, Piezo Mechanics
The F-716 6DOF photonic alignment platform from PI (Physik Instrumente) is a six-axis system based on air bearings for maintenance-free, 24/7 operation in alignment and probing applications.

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Latest Webinars

Precision Automation Principles for the Optimal Testing and Packaging of PIC Devices

Production-scale testing of silicon photonic devices continues to be a challenge due to the multi-degree-of freedom, high-precision, optical alignments required for wafer- and die-level testing. Wide variances in chip designs and coupling features complicate test procedures, making it difficult to identify a system capable of producing repeatable measurements across various topologies. Brett Heintz of Aerotech Inc. provides a guide for selecting precision motion equipment to minimize the impact of positioning errors on optical alignment test results. Presented by Aerotech.

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CALL FOR ARTICLES!
Photonics Media is currently seeking technical feature articles on a variety of topics for publication in our magazines (Photonics Spectra, BioPhotonics, and Vision Spectra). Please submit an informal 100-word abstract to [email protected], or use our online submission form.

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