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wafer processing x
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gallium arsenide
Gallium arsenide (GaAs) is a compound semiconductor material composed of gallium (Ga) and arsenic (As). It belongs to the III-V group of semiconductors and has a zincblende crystal structure. GaAs is...
laser annealing
Laser annealing is a process that involves using a laser beam to heat and modify the microstructure of a material, typically a thin film or surface layer, with the objective of improving its...
lithography
Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of...
photolithography
Photolithography is a key process in the manufacturing of semiconductor devices, integrated circuits, and microelectromechanical systems (MEMS). It is a photomechanical process used to transfer...
singulated die
A singulated die refers to an individual semiconductor chip that has been separated or singulated from a larger wafer. This term is commonly used in the semiconductor manufacturing industry. ...
slicing and cutting machines - for crystals, quartz, glass, etc.
A crystal, glass, or quartz slicing and cutting machine is a specialized piece of equipment used in the manufacturing process to precisely cut and slice materials such as crystals, glass, and quartz...
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