Reactive evaporation refers to a process in thin-film deposition where a material is deposited onto a substrate through evaporation, and chemical reactions take place during or after the evaporation process. This technique is often used in the production of thin films with specific properties or compositions that result from the reaction between the evaporated material and a reactive gas or vapor in the deposition environment.
In reactive evaporation, a solid material (often a metal or a compound) is heated to the point of evaporation, and the resulting vapor reacts with a reactive gas or vapor introduced into the deposition chamber. The reaction can lead to the formation of a compound or alloy that becomes part of the deposited thin film. The choice of reactive gases and their concentration can be adjusted to control the composition, structure, and properties of the deposited film.
This method is commonly employed in techniques like physical vapor deposition (PVD), where the material is evaporated in a vacuum environment. Reactive evaporation is used to deposit thin films with tailored properties, such as specific chemical compositions, improved adhesion, or altered optical and electrical characteristics. It finds applications in various industries, including electronics, optics, and coatings, where precise control over film properties is essential.