Diode Laser System for Laser Wafer Annealing
Features:
• Narrow beam width
• High power density
• Modular design, easy maintenance
• High product consistency
• Multiple additional functions
Applications:
• Dynamic surface annealing
• Laser spike annealing
• Film annealing
• Material surface treatment
56 Zhangba 6th Rd.
High-Tech Zone
Xi'an, Shaanxi 710077
China
Phone: +86 29 8188 9945