Wafer Bonding Shipment

Wafer bonding and lithography equipment supplier EV Group of St. Florian, Austria, has shipped two wafer bonding systems to the University of Michigan’s Lurie Nanofabrication Facility, a center for microelectromechanical systems (MEMS) and microsystems research and a member of the National Nanotechnology Infrastructure Network. The new systems will provide high-force wafer bonding capabilities to increase the level of the university’s MEMS research efforts.

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About EV Group (EVG)

Published: April 2010

Glossary

lithography: Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of a desired pattern onto a photosensitive material called a resist, which is coated onto the substrate. The resist is then selectively exposed to light or other radiation using a mask or reticle that contains the pattern of interest. The lithography process can be broadly categorized into several...
microelectromechanical systems: Refers to micron-size complex machines that have physical dimensions suitable for the fabrication of optical switches for use in state-of-the-art communications networks.

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AustriaBusinessEV Groupindustriallight speedlithographyLurie Nanofabrication FacilityMEMSmicroelectromechanical systemsmicrosystems researchNational Nanotechnology Infrastructure NetworkTest & MeasurementUniversity of Michiganwafer bondingwafer bonding systemWafers

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